Expert in Flip-Chip Bonding and Hybrid Integration

3 days ago


Queenstown, New Zealand Agency For Science, Technology And Research Full time

Job Requirements:

The Agency For Science, Technology And Research is seeking a highly skilled Senior Research Engineer or Senior Research Engineer to join our team. The successful candidate will be responsible for developing advanced fine-pitch flip-chip & hybrid bonding techniques for chip-to-wafer, emphasizing bonding parameter optimization and process enhancements. They will also optimize Chip to wafer hybrid bonding processes, including the selection of low-temperature organic and inorganic bonding materials, surface preparation, and bonding methods.

About the Team:

We are a dynamic team of researchers and engineers working together to drive scientific and technological advancements. We are committed to fostering innovation and collaboration across various disciplines. Our team is passionate about developing cutting-edge solutions that address real-world challenges.

Responsibilities:

  • Develop advanced fine-pitch flip-chip & hybrid bonding techniques for chip-to-wafer
  • Optimize Chip to wafer hybrid bonding processes
  • Conduct engineering experiments for process characterization

Skills and Qualifications:

Candidates should meet the following criteria: Educational Background: Bachelor's degree in Materials Science and Engineering, Mechanical or Chemical Engineering, Electronics, Electrical and Computer Engineering, or a related field. Experience: 1 to 6 years of experience in microelectronic devices, circuits, and hybrid component integration, 2.5D/3D heterogeneous integration applications. Technical Expertise: Hands-on experience in flip chip bonding is preferable. Knowledge: Knowledge of hybrid bonding equipment technologies and bonding materials and methodologies, and reliability characterization is preferable, but not mandatory. Skills: Strong analytical and problem-solving skills. Proficiency in data analysis and interpretation and design of experiments. Excellent written and verbal communication abilities. Teamwork: Ability to work collaboratively in a research-oriented environment (OEMs, customers, and internal stakeholders). Demonstrated ability to manage multiple tasks and projects simultaneously.



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